JPH0717165Y2 - 可撓性回路基板のキャリアテープ - Google Patents
可撓性回路基板のキャリアテープInfo
- Publication number
- JPH0717165Y2 JPH0717165Y2 JP10784090U JP10784090U JPH0717165Y2 JP H0717165 Y2 JPH0717165 Y2 JP H0717165Y2 JP 10784090 U JP10784090 U JP 10784090U JP 10784090 U JP10784090 U JP 10784090U JP H0717165 Y2 JPH0717165 Y2 JP H0717165Y2
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- circuit board
- carrier tape
- adhesive
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 15
- 239000010408 film Substances 0.000 description 14
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Structure Of Printed Boards (AREA)
- Package Frames And Binding Bands (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10784090U JPH0717165Y2 (ja) | 1990-10-15 | 1990-10-15 | 可撓性回路基板のキャリアテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10784090U JPH0717165Y2 (ja) | 1990-10-15 | 1990-10-15 | 可撓性回路基板のキャリアテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465479U JPH0465479U (en]) | 1992-06-08 |
| JPH0717165Y2 true JPH0717165Y2 (ja) | 1995-04-19 |
Family
ID=31854538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10784090U Expired - Lifetime JPH0717165Y2 (ja) | 1990-10-15 | 1990-10-15 | 可撓性回路基板のキャリアテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717165Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5942507B2 (ja) * | 2012-03-16 | 2016-06-29 | 日立化成株式会社 | 電子部品の製造方法 |
| WO2017138381A1 (ja) * | 2016-02-10 | 2017-08-17 | 株式会社村田製作所 | フレキシブルケーブル付電子部品連およびフレキシブルケーブル付電子部品連の製造方法 |
-
1990
- 1990-10-15 JP JP10784090U patent/JPH0717165Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465479U (en]) | 1992-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |